After the worldwide downturn and crisis in 2008 and 2009, the automotive market worldwide has bounced back and recovered well. In 2013, approximately 75 million new light vehicles (cars and light trucks) were shipped worldwide. This number is projected to reach 110 million by 2020. Currently, each vehicle has an average of 60-100 sensors on board. Because cars are rapidly getting "smarter" the number of sensors is projected to reach as many as 200 sensors per car. These numbers translate to approximately 22 billion sensors used in the automotive industry per year by 2020.
So what are the emerging applications enabled by the next-generation sensors and electronics? And what are the technologies that will enable new applications? These are the key questions that will drive the discussion at this annual event - Automotive Sensors and Electronics Expo 2015.
Conference topics will include:
Emerging sensors and electronics applications
Supply chain trends and challenges
Government regulations and mandates
Testing methodologies, including test equipment and techniques
Interface and calibration circuits
Devices with substantially improved performance
System integration and end use applications
Emerging sensors and electronics technologies
Component and wafer-level packaging technologies
Sensors and electronics for telematics applications
Reliability testing and methods
Environmental effects and compensation methods
Sensors and electronics for vehicle diagnostics
The conference and reception will be held at the DoubleTree Detroit-Dearborn. A block of rooms has been reserved at the DoubleTree for a negotiated rate of $109.00 per night. The room block cut-off date is April 27, 2015.
Confirmed participants include individuals from companies such as Apple, Alpha Precision, Analog Devices, ARM, Auto Harvest, Brose, BMW, Freescale, Chrysler, GM, Ford, Invenios, Google, Honda, MNX, Merit Sensor, IHS, Henkel Electronic Materials, Wayne State University, University of Michigan, Hitachi-Dupont Microsystems, C2MI, Littelfuse, Delphi, Cooper Standard, Gentherm, Standex-Meder Electronics, Grinding & Dicing Services, SKF USA, InnoState, Detroit Chamber of Commerse, Dow Corporate Ventures, Sonix, AISIN Technical Center, MicroGen, Leidos, SBD, RF Micron, Sensirion, ST, Toyota, Unisem, Strategy Analytics, AMS, and others.
You can participate as a speaker, sponsor, exhibitor, or attendee.